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HyperX Savage 4GB (1 x 4GB) Memory Module 1600MHz DDR3 ...
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HyperX Savage 4GB (1 x 4GB) Memory Module 1600MHz DDR3 CL9 DIMM

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Product Description

HyperX Savage 4GB (1 x 4GB) Memory Module 1600MHz DDR3 CL9 DIMM

HyperX HX316C9SR/4 is a 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module supports Intel XMP (Extreme Memory Profiles). Each module has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers.

  • JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
  • VDDQ = 1.5V (1.425V ~ 1.575V)
  • 800MHz fCK for 1600Mb/sec/pin
  • 8 independent internal banks
  • Programmable CAS latency: 11, 10, 9, 8, 7, 6
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (interleave without any limit, sequential with starting address '000' only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or
  • MRS)
  • Bi-directional Differential Data Strobe
  • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C,
  • 3.9us at 85°C < TCASE < 95°Cº
  • Asynchronous Reset
  • PCB: Height 1.180 inch (30.00mm), single sided component


Memory

  • Memory Size 4096 MB ( 1 module(s) x 4096 MB )
  • Memory Type DDR3
  • Memory Speed 1600 MHz
  • Memory Package DIMM
  • Pin Configuration 240 pins
  • CAS Latency CL9
  • Module Configuration 512M x 64

Electrical

  • Voltage 1.5 V

Environmental

  • Operating Temperature 0 to 85 °C
  • Non Operating Temperature -55 to 100 °C

Physical

  • Form Factor Memory Module
  • Case Colour Red
  • Dimensions 13.3 cm (W) x 3.2 cm (D) x

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