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HyperX Savage 8GB (2 x 4GB) Memory Kit 1600MHz DDR3 CL9...
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HyperX Savage 8GB (2 x 4GB) Memory Kit 1600MHz DDR3 CL9 DIMM

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Product Description

HyperX Savage 8GB (2 x 4GB) Memory Kit 1600MHz DDR3 CL9 DIMM

HyperX HX316C9SRK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers.

  •  JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
  •  VDDQ = 1.5V (1.425V ~ 1.575V)
  •  800MHz fCK for 1600Mb/sec/pin
  •  8 independent internal banks
  •  Programmable CAS latency: 11, 10, 9, 8, 7, 6
  •  Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  •  8-bit pre-fetch
  •  Burst Length: 8 (interleave without any limit, sequential with starting address '000' only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
  •  Bi-directional Differential Data Strobe
  •  Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
  •  On Die Termination using ODT pin
  •  Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº
  •  Asynchronous Reset
  •  PCB: Height 1.180 inch (30.00mm), single sided component

Memory
Memory Size 8192 MB ( 2 module(s) x 4096 MB )
Memory Type DDR3
Memory Speed 1600 MHz
Memory Package DIMM
Pin Configuration 240 pins
CAS Latency CL9
Module Configuration 512M x 64


Electrical
Voltage 1.5 V


Environmental
Operating Temperature 0 to 85 °C
Non Operating Temperature -55 to 100 °C


Physical
Form Factor Memory Kit
Case Colour Red
Dimensions 13.3 cm (W) x 3.2 cm (D)

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